SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND RINSING FLUID

摘要

The present invention provides a method for manufacturing a semiconductor device having: a step for applying a semiconductor seal composition on a semiconductor substrate provided with an interlayer insulating layer having a concave section, and wiring containing copper of which at least a portion is exposed on at least a portion of the bottom surface of the concave section, and forming a seal layer on at least the bottom and side surfaces of the concave portion; and a step for thermally treating, at a temperature of 200-425°C, the side surface on which the seal layer of the semiconductor substrate is formed, and removing at least a portion of the seal layer formed on the exposed surface of the wiring. The semiconductor seal composition has a cationic functional group and contains a polymer having a weight-average molecular weight of 2000-1000000, the Na and K content being no more than 10 wt ppb in elemental terms.