发明名称 LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
摘要 There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T@t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7@Dc/Da@1.5 is satisfied.
申请公布号 US2014022692(A1) 申请公布日期 2014.01.23
申请号 US201313839781 申请日期 2013.03.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YOON SEOK HYUN;LEE BYOUNG HWA;KIM CHANG HOON;KWON SANG HOON
分类号 H01G4/12 主分类号 H01G4/12
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