发明名称 |
THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARDS |
摘要 |
A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications. |
申请公布号 |
US2014020933(A1) |
申请公布日期 |
2014.01.23 |
申请号 |
US201313943588 |
申请日期 |
2013.07.16 |
申请人 |
CONLEY NICHOLAS RYAN;HEDIN LOGAN BROOK;MILLER DAVID MICHAEL |
发明人 |
HEDIN LOGAN BROOK;MILLER DAVID MICHAEL;CONLEY NICHOLAS RYAN |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|