SEMICONDUCTOR CHIP COMPRISING HEAT RADIATION PART AND METHOD FOR FABRICATING THE SAME CHIP

摘要

A semiconductor chip is disclosed. According to an embodiment of the present invention, the semiconductor chip includes: a first surface on which an integrated circuit is arranged; and a semiconductor substrate which faces the first surface and which has a second surface having a heat radiation part. The heat radiation part includes: a heat radiation pattern having a dent part and a protrusion part which are vertical to the second surface; and a heat radiation layer of which the top surface is flat and which is made by coating the top of the heat radiation pattern with a metallic material.