| 摘要 |
A light emitting device package is provided to improve heat dissipation characteristics and to simplify a manufacture process by employing a heat dissipation pattern for widening an exposed surface area of a substrate in order to effectively release heat to the outside. A light emitting device(200) is mounted on a substrate(100). A heat dissipation pattern(102) is passed through the substrate to widen a heat dissipation area. The heat dissipation pattern is formed on the substrate except for a region on which the light emitting device is mounted. The heat dissipation pattern includes a through-hole or a dissection pattern. The through-hole includes at least one among a cylindrical pillar shape, an oval pillar shape, and a polygonal pillar shape. The dissection pattern includes at least one of a straight line dissection pattern, a wave dissection pattern, and a rectangular dissection pattern. |
