发明名称 FILM FORMING METHOD AND FILM FORMING DEVICE
摘要 <p>In a film forming method, a coating composition containing film components is coated on a plastic substrate to form a coating film. By irradiating electromagnetic waves to the coating film, the coating film is dried and/or modified to form a film. The film can be a conductor film, a semi-conductor film or a dielectric film. When forming a conductor film, a coating composition containing metallic nanoparticles is used as the coating composition; when forming a semi-conductor film, an organic semi-conductor material is used as the coating composition; and when forming a dielectric film, an organic dielectric material is used as the coating composition.</p>
申请公布号 KR20140009379(A) 申请公布日期 2014.01.22
申请号 KR20137024652 申请日期 2012.02.22
申请人 TOKYO ELECTRON LIMITED 发明人 SHIMIZU MASAHIRO;ITOH HITOSHI
分类号 H01L21/288;H05K3/22 主分类号 H01L21/288
代理机构 代理人
主权项
地址