发明名称 |
Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabrication method therefor |
摘要 |
An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith. |
申请公布号 |
US8633373(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20080152195 |
申请日期 |
2008.05.12 |
申请人 |
GREIFF PAUL;DIMATTEO ROBERT;BROWN ERIC;LEITZ CHRISTOPHER;MTPV POWER CORPORATION |
发明人 |
GREIFF PAUL;DIMATTEO ROBERT;BROWN ERIC;LEITZ CHRISTOPHER |
分类号 |
H01L0031/000058 |
主分类号 |
H01L0031/000058 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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