METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE AND THE DEVICE THEREBY

摘要

The present invention relates to a light emitting device and a method of manufacturing the same for improving adhesion between an encapsulation material and a metal substrate. The method comprises the steps of: preparing a metal substrate in which a vertical insulating layer is formed; forming a metal plating layer on the top of the substrate except for the vertical insulating layer; forming at least one process groove at a portion of the metal plating layer that is formed at both sides of the substrate based on the vertical insulating layer so that the metal substrate is exposed through the process groove; and attaching an optical element chip on one side of metal plating layer based on the vertical insulating layer, wherein one electrode of the optical element chip is electrically connected, through wire or solder, to the metal plating layer to which the optical element is attached, and the other electrode is connected to the other side of the metal plating layer based on the vertical insulating layer; and shielding the optical element chip and peripheries thereof with an encapsulation material, wherein the encapsulation material is inserted into the process groove to at least fill the process groove. [Reference numerals] (110) Vertical insulating layer