发明名称 |
Coating apparatus and coating method |
摘要 |
In a coating apparatus, a distributor plate 104 is disposed upstream of a silicon wafer 101 relative to the direction of flow of reactive gas. The distributor plate 104 has therein first through-holes 104a and second through-holes 104b arranged so as not to meet the first through-holes 104a. The reactive gas passes through the first through-holes 104a and flows down toward the silicon wafer 101. Further, a cooling gas passes through the second through-holes 104b. |
申请公布号 |
US8632634(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20090508012 |
申请日期 |
2009.07.23 |
申请人 |
MORIYAMA YOSHIKAZU;SUZUKI KUNIHIKO;HIRATA HIRONOBU;NUFLARE TECHNOLOGY, INC. |
发明人 |
MORIYAMA YOSHIKAZU;SUZUKI KUNIHIKO;HIRATA HIRONOBU |
分类号 |
C23C16/455;C23C16/06;C23C16/22;C23F1/00;H01L21/306 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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