发明名称 |
Package structure for a chip and method for fabricating the same |
摘要 |
The embodiment provides a package structure for a chip and a method for fabricating the same. The package structure for the chip includes a chip having a substrate and a bonding pad structure. The chip has an upper surface and a lower surface. An upper packaging layer covers the upper surface of the chip. A spacer layer is between the upper packaging layer and the chip. A conductive path is electrically connected to the bonding pad structure. An anti-reflective layer is disposed between the spacer layer and the upper packaging layer. An overlapping region is between the anti-reflective layer and the spacer layer. |
申请公布号 |
US8633558(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20100981640 |
申请日期 |
2010.12.30 |
申请人 |
LIN TA-HSUAN;SHIU CHUAN-JIN;CHENG CHIA-MING;LIU TSANG-YU |
发明人 |
LIN TA-HSUAN;SHIU CHUAN-JIN;CHENG CHIA-MING;LIU TSANG-YU |
分类号 |
H01L31/0216;H01L31/18 |
主分类号 |
H01L31/0216 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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