| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board that can be shortened in manufacturing time and has a high efficiency percentage, and a method of manufacturing the same.SOLUTION: A method of manufacturing a multilayer circuit board includes the steps of: providing three both-sided copper foil substrates each including a first copper foil layer, an insulation layer, and a second copper foil layer which are laminated in order; forming the three both-sided copper foil substrates on a first circuit board; acquiring a second circuit board after jostling a dielectric layer against first conductive circuit layers of two first circuit boards, and acquiring a third circuit board by forming a first metal bump on the first conductive circuit layer of the other one first circuit board and forming at least one second metal bump on a second conductive circuit layer; and acquiring a multi-layer circuit board by jostling two second circuit boards and one third circuit board once, and electrically connecting the first metal bump and second metal bump to the first conductive circuit layers through one dielectric layer. Also there is provided the multilayer circuit board. |
