发明名称 ELEMENT BUILT-IN WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive element build-in wiring board of a novel structure where functional elements, e.g., MEMS or SAW filters, are embedded in a wiring board consisting at least of one pair of wiring layers, and an insulation layer disposed therebetween, in such a state that the function of the functional surface is not degraded.SOLUTION: The element build-in wiring board includes a pair of first wiring layer and a second wiring layer arranged to face each other, an insulation layer disposed between the first wiring layer and second wiring layer, a functional element mounted on the first wiring layer so that a functional surface is exposed to a hollow part formed in the insulation layer, and a pattern layer constituting the sidewall of the hollow part and defining the hollow part.
申请公布号 JP2014011323(A) 申请公布日期 2014.01.20
申请号 JP20120147247 申请日期 2012.06.29
申请人 DAINIPPON PRINTING CO LTD 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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