| 摘要 |
Provided is a laminated body used in the manufacture of a flexible electronic device, the manufacture thereof comprising a process of heating a laminated body formed by laminating a glass plate and a base material film, wherein the warpage (curl) of the laminated body caused by heating can be reduced. The present invention provides a laminated body to be used in the manufacture of a flexible electronic device which is manufactured by forming a laminated body by adhering a substrate film on one side of a glass plate having a thickness of 0.3 to 0.7 mm, forming an electronic circuit on the substrate film of the laminated body, and thereafter, delaminating the glass plate, wherein the range of the thickness of a biaxially-oriented polyester film used for the substrate film satisfies the following formulae: FT=0.025; FT/GT2=0.25, (in the above formulae, FT represents a film thickness (mm), and GT represents a glass plate thickness (mm)). |
