| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can securely form a desired thickness of a wafer.SOLUTION: A polishing device includes polishing means having a polishing pad and an electric motor for driving and rotating the polishing pad, polishing liquid supply means, polish-feeding means, polishing load detecting means, load current value detecting means, and control means. When a wafer is polished by rotating a chuck table with a wafer held, polish-feeding while rotating the polishing pad, and making the polishing pad contact with an upper surface of the wafer held on the chuck table while supplying a polishing liquid, the control means controls the polish-feeding means so that a detected polishing load becomes a predetermined value on the basis of a detection signal from the polishing load detecting means, and controls the polish-feeding means when a predetermined time passes after a load current value of power supplied to the electric motor reaches a predetermined value on the basis of a detection signal from the load current value detecting means after the polishing load reaches a predetermined value to release the polishing load by the polishing pad. |
