| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which places a suction surface of a chip of a bonding tool in direct contact with a cooling surface thereby realizing faster cooling compared to the cooling with a gas and shortening the work time of the bonding.SOLUTION: The following means is adopted in a bonding device. Firstly, the bonding device includes: a bonding head 3 including a bonding tool 10 where a suction surface of a chip is formed and heating means 21; chip supply means; a bonding stage on which a substrate is placed; head moving means which moves the bonding head 3 between a chip supply position and a bonding position; and cooling means 6 which cools the bonding tool 10. Secondly, the bonding tool 10 receives a supplied chip at the chip supply position and is heated at the bonding position to bond the chip. Then, the bonding tool 10 is cooled by the cooling means 6. Thirdly, the cooling is performed by placing the suction surface of the bonding tool 10 in contact with a cooling surface of the cooling means 6. |
