发明名称 |
ALUMINUM COMPOUND, RAW MATERIAL FOR THIN FILM FORMATION, AND METHOD OF PRODUCING THIN FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide: an aluminum compound with a low melting point, sufficient volatility and high thermal stability; a raw material for thin film formation containing the same; and a method of producing a thin film by using the raw material.SOLUTION: Provided are an aluminum compound represented by the specified general formula (I), a raw material for thin film formation containing the aluminum compound, and a method of producing a thin film. The method comprises: vaporizing the raw material for thin film formation to obtain vapor containing the aluminum compound; introducing the vapor into a deposition chamber in which a substrate is placed; and subjecting the aluminum compound to decomposition and/or chemical reaction to form a thin film containing aluminum on a surface of the substrate. |
申请公布号 |
JP2014005242(A) |
申请公布日期 |
2014.01.16 |
申请号 |
JP20120142927 |
申请日期 |
2012.06.26 |
申请人 |
ADEKA CORP |
发明人 |
HATASE MASAKO;SAKURAI ATSUSHI;SHIRATORI TSUBASA |
分类号 |
C07F5/06;C23C16/40;H01L21/316 |
主分类号 |
C07F5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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