| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape for wafer processing and a manufacturing method of a tape for wafer processing, which can improve a peel strength with a wafer ring; and to provide a manufacturing method of a semiconductor device using the tape.SOLUTION: A tape used in processing a semiconductor wafer comprises: a peeling base material; an adhesive layer provided on one surface side of the peeling base material; a pressure-sensitive adhesive layer which is provided in such a way as to cover the adhesive layer and composed of at least two layers; and a base material film provided in such a way as to cover the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer and the base material film have sticking areas to the wafer ring, which project outward from the adhesive layer. In the sticking area, the pressure-sensitive adhesive layer is exposed on the peeling base material side, and a relation at 25°C between a pressure-sensitive adhesive area (c) of the pressure-sensitive adhesive layer in the sticking area on the peeling base material side and a pressure-sensitive adhesive area (D) of the pressure-sensitive adhesive layer which contacts the adhesive layer satisfies a relation expression (1): "adhesion of pressure-sensitive adhesive area (C)>adhesion of pressure-sensitive adhesive area (D)". |
