SUPERPOSING APPARATUS AND SUPERPOSING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the accuracy of alignment between a wafer and a support plate in a superposing apparatus.SOLUTION: The superposing apparatus according to the present invention is configured such that: the center positions of a substrate and a support which are held by a center position detecting unit 3 are detected; the substrate and the support are conveyed from the center position detecting unit 3 to a superposing unit 6; and then the substrate and the support are superposed on each other in the superposing unit 6 so that the detected center positions of the substrate and the support overlap.