发明名称 Drain Extended Field Effect Transistors and Methods of Formation Thereof
摘要 In an embodiment of the invention, a semiconductor device includes a first region having a first doping type, a channel region having the first doping type disposed in the first region, and a retrograde well having a second doping type. The second doping type is opposite to the first doping type. The retrograde well has a shallower layer with a first peak doping and a deeper layer with a second peak doping higher than the first peak doping. The device further includes a drain region having the second doping type over the retrograde well. An extended drain region is disposed in the retrograde well, and couples the channel region with the drain region. An isolation region is disposed between a gate overlap region of the extended drain region and the drain region. A length of the drain region is greater than a depth of the isolation region.
申请公布号 US2014015010(A1) 申请公布日期 2014.01.16
申请号 US201314028403 申请日期 2013.09.16
申请人 INFINEON TECHNOLOGIES AG 发明人 SHRIVASTAVA MAYANK;RUSS CORNELIUS CHRISTIAN;GOSSNER HARALD;RAO RAMGOPAL
分类号 H01L29/78 主分类号 H01L29/78
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