| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost for connecting a high-voltage substrate to an image forming part, and contact reliability of a contact.SOLUTION: A high-voltage substrate 301 includes a high-voltage contact 343. The high-voltage contact 343 has a plurality of copper foil patterns 401 formed radially from the center with a predetermined width. The copper foil patterns 401 are connected at the center. One of the copper foil patterns 401 is supplied with power. On the copper foil patterns 401, cream solder 402 containing a flux is applied in a range wider than the predetermined width, and heated thereafter, to form solder 502 only on the copper foil patterns. |
