| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED module capable of increasing heat dissipation and realizing a high light output.SOLUTION: In an LED module 1, a mounting substrate 2 includes: a heat transfer part 20 having LED chips 3 mounted on one side thereof; and a wiring pattern 22 disposed at the other side of the heat transfer part 20 and connected to the LED chips 3 via wires 26. The LED module 1 includes: first sealing parts 37 each sealing a part of each wire 26 within a through hole 20b of the heat transfer part 20 and embedded in the through hole 20b; and a second sealing part 36 sealing each LED chip 3 and a part of each wire 26 between the LED chip 3 and the first sealing parts 37. The second sealing part 36 contains a fluorescent substance which emits light of a wavelength longer than that from the LED chip 3 by being excited by the light emitted from the LED chip 3 and a transparent material. The first sealing parts 37 contain a first filer having the reflection ratio higher than that of a first resin. |
