| 摘要 |
PROBLEM TO BE SOLVED: To ensure good frequency characteristics at a connection between a coaxial structure such as a connector and a multilayer wiring board.SOLUTION: A connection part 7 of a multilayer wiring board 2 on which a small connector 1 is mounted has a connection structure (joining by solder, silver paste, or the like (connection member 11)) formed by exposing a ground layer 6, and directly connecting, to the connectin part 7, an exposed part 6A and an external conductor 10 so as to be electrically conducted with each other. Accordingly, a high frequency signal path on a ground side is simplified; an increase in ground inductance of the small connector 1 and the multilayer wiring board 2 is suppressed; and waveform quality of high-speed data signals is ensured. |
