发明名称 |
METHOD TO IMPROVE WITHIN WAFER UNIFORMITY OF CMP PROCESS |
摘要 |
Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired extent of variation of within wafer uniformity of a semiconductor wafer. |
申请公布号 |
US2014015107(A1) |
申请公布日期 |
2014.01.16 |
申请号 |
US201213547333 |
申请日期 |
2012.07.12 |
申请人 |
CHEN CHING-KUN;CHEN CHUN-FU;SU CHIN-TA;MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
CHEN CHING-KUN;CHEN CHUN-FU;SU CHIN-TA |
分类号 |
B24B49/14;B24B49/02;B24D3/00;H01L21/306;H01L29/06 |
主分类号 |
B24B49/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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