PHOTOSENSITIVE RESIN COMPOSITION, CONDUCTIVE WIRE PROTECTION FILM, AND TOUCH PANEL MEMBER

摘要

The purpose of the present invention is to provide an alkali developable negative photosensitive resin composition which has extremely excellent storage stability without deteriorating characteristics such as high hardness, high transparency, high heat resistance and high chemical resistance. The present invention provides a photosensitive resin composition which contains: an unsaturated group-containing resin (D) that is obtained by adding an epoxy group-containing unsaturated compound (C) to some acid groups of a copolymer that is obtained by copolymerizing a (meth)acrylic acid ester (A) and a compound (B) containing an unsaturated group and an acid; a (meth)acrylic compound (E) having a specific structure; a silane compound (G) having a substituent that is selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group and an isocyanate group; and a photopolymerization initiator (F).