| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board excellent in heat resistance and toughness, also excellent in conductivity, and capable of being reduced in thickness at low cost, and a method for manufacturing the wiring board.SOLUTION: The present invention relates to the wiring board which includes a resin sheet including a resin, and conductor layers formed on surfaces of the resin sheet, and has a via conductor penetrating through the resin sheet and comprising copper or a copper alloy. The wiring board includes an intermetallic compound at a junction between at least one of the conductor layers and the via conductor, the intermetallic compound having a melting point of 300°C or more and being produced by a reaction between first metal comprising Sn or an alloy containing 70 wt.% or more of Sn and second metal comprising a Cu-Ni alloy or Cu-Mn alloy having a melting point higher than that of the first metal. |
