发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an optical substrate which is inexpensive and has an excellent connection characteristic and to provide a method of manufacturing the optical substrate. <P>SOLUTION: A first electric wiring 26A is formed on the first face 10A of an insulating resin layer 10. A recessed part 90 is formed on the first face 10A. A light receiving/emitting element 60 is fitted on the recessed part 90 in a state that a light receiving/emitting part 60A is directed in the direction opposite to the bottom face 90A of the recessed part 90, and the light receiving/emitting part 60A is located at a point closer to the bottom face 90A than the first face 10A. The recessed part 90 is sealed by a translucent sealing resin 80 so as to cover the light receiving/emitting part 60A. A via hole 35 is formed on the sealing resin 80 to expose the electrode 60B of the light receiving/emitting element 60. A connection part 36 is formed to connect the electrode 60B and the first electric wiring 26A via the via hole 35. An optical waveguide 50 having an optical input/output part 50A is mounted on the first face 10A in a state that the optical input/output part 50A is positioned to be directed to the light receiving/emitting part 60A. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5387240(B2) 申请公布日期 2014.01.15
申请号 JP20090200557 申请日期 2009.08.31
申请人 发明人
分类号 G02B6/122;G02B6/42 主分类号 G02B6/122
代理机构 代理人
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