发明名称 Injection-moulded product and a mould and a method for manufacturing the same
摘要 <p>An injection-moulded product comprising a reinforcement member, a heat resistant member and an injection-moulded member. The reinforcement member is formed with a through-hole. The heat-resistant member is attached to an outer surface of the reinforcement member to close an opening of the through-hole. The injection-moulded member comprises a synthetic resin that encloses at least part of the outer surface of the reinforcement member. A mould for manufacturing an injection-moulded product and a method of manufacturing an injection-moulded product are also disclosed.</p>
申请公布号 EP2684668(A1) 申请公布日期 2014.01.15
申请号 EP20130175610 申请日期 2013.07.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SANG-HYEON;LEE, SU-KYU
分类号 B29C45/14;G06F1/16;H01Q1/24;H01Q1/40;H04M1/02 主分类号 B29C45/14
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