| 摘要 |
A semiconductor device is provided with a power module capable of supplying an alternate current to a load, while a direct current is supplied from a battery to the power module for conversion into the alternate current, a cooling member capable of radiating heat generated by the power module, and a mounting member, integrally formed with a spring portion protruding in part therefrom and having elasticity, which allows the power module to be mounted on the cooling member under a state where one surface of the power module is caused to face the cooling member and the spring portion is pressed against the other surface of the power module in opposition to the one surface thereof. |
