发明名称 |
Method for measuring contacting thermal resistance of one-dimensional structures |
摘要 |
A method for measuring a contacting thermal resistance of one-dimensional structures is provided. A first one-dimensional structure and A second one-dimensional structure are crossed and in contact with each other to form a suspended junction. A point P of the first one-dimensional structure is heated until the first one-dimensional structure and the second one-dimensional structure reach a thermal equilibrium. A point A and a point B are selected on the first one-dimensional structure and a point C and a point D are selected on the second one-dimensional structure, wherein the point B, the point A, the suspended junction, the point C and the point D are arranged equidistantly with a distance Deltax. A temperature difference DeltaTj is calculated by the formula DeltaTj=DeltaTAC-DeltaTBA-DeltaTCD. The heat flux Qj is calculated by the formula Qj=2kDeltaTCD/Deltax. The contacting thermal resistance Rj is calculated by the formula Rj=DeltaTj/Qj. |
申请公布号 |
US8628237(B1) |
申请公布日期 |
2014.01.14 |
申请号 |
US201313748757 |
申请日期 |
2013.01.24 |
申请人 |
TSINGHUA UNIVERSITY;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LIU JUN-KU;LI QUN-QING;ZOU YUAN;FAN SHOU-SHAN |
分类号 |
G01K17/00;G01J5/00;G01K1/00;G01K1/16;G01K7/00;G01N25/00;G01N25/20 |
主分类号 |
G01K17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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