| 摘要 |
A die comprising two or more active electronic components is provided. The active electronic components are capable of being interconnected using interconnections external to the die. The die may be encased within a package, and the active electronic components may be interconnected using interconnections external to the package. By interconnecting the active electronic components, either directly or through one or more additional components, a desired circuit may be formed. In some examples, the desired circuit may be a monolithic microwave integrated circuit (MMIC). Methods of forming the circuit are also disclosed. |
