CONTACTLESS CHUCK FOR TRANSFERRING A WAFER

摘要

A contactless chuck for transferring a wafer comprises: a cylindrical housing which has a lower panel having at least one through hole around the center; a nozzle which is arranged at the upper part of the through hole in the housing and which forms negative pressure for gripping the wafer in the lower part of the housing by spraying compressed air spirally; and a guide member which is installed at the lower part of the housing for limiting vertical movements of the wafer and guiding the wafer vertically in a way the edge of the wafer is kept upward not to contact the lower side of the lower panel. By preventing the compressed air from being sprayed to the wafer, the wafer is not contaminated due to the compressed air.