发明名称 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 FIELD: chemistry.SUBSTANCE: curable composition contains (A) organopolysiloxane of the following averaged structural formula: R?SiO, in which Rdenotes unsubstituted or halogen-substituted univalent hydrocarbon groups; although in one molecule, at least two groups denoted R, are alkenyl groups, and at least 30 mol % of all groups denoted Rare aryl groups; and a is a number ranging from 0.6 to 2.1; (B) organopolysiloxane which contains in one molecule at least two hydrogen atoms bonded with silicon and at least 15 mol % of all organic groups bonded with silicon which are in form of aryl groups; (C) orgnopolysiloxane with a branched chain, having the following averaged formula of the block: (RSiO)(R?SiO)(R?SiO)(SiO)(XO), in which each Rindependently denotes an alkyl group, alkenyl group, aryl group or an epoxy-containing organic group; although in one molecule, at least 5 mol % of all groups denoted Rare alkenyl groups, at least 15 mol % of all groups denoted Rare aryl groups, and at least 10 mol % of all groups denoted Rare epoxy-containing organic groups, X denotes hydrogen or an alkyl group; and b is a positive number, c is 0 or a positive number, d is 0 or a positive number, e is 0 or a positive number, f is 0 or a positive number, c/b is number ranging from 0 to 10, d/b is a number ranging from 0 to 5, e/(b+c+d+e) is a number ranging from 0 to 0.3, and f/(b+c+d+e) is a number ranging from 0 to 0.02; h(D) a hydrosilylation catalyst. Component (B) is used in such an amount that the molar ratio of hydrogen atoms bonded with silicon contained in component (B) and alkenyl groups contained in components (A) and (C) is in the range from 0.1 to 5. Component (C) is contained in amount of 0.1 to 20 pts.wt per 100 pts.wt total content of components (A) and (B). Component (D) is contained in an amount sufficient for accelerating curing of the composition.EFFECT: composition is capable of forming a curable volume, having a high refraction index and strong adhesion with substrates.8 cl, 1 dwg, 1 tbl
申请公布号 RU2503696(C2) 申请公布日期 2014.01.10
申请号 RU20100151565 申请日期 2009.06.11
申请人 DAU KORNING TOREJ KO., LTD. 发明人 SAGAVA TAKASHI;TERADA MASAJOSHI;JOSHITAKE MAKOTO
分类号 C08L83/06;H01L23/29 主分类号 C08L83/06
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