BINDER RESIN COMPOSITION FOR PREFORM, BINDER PARTICLE, PREFORM, AND FIBER-REINFORCED COMPOSITE MATERIAL

摘要

[Problem] To provide a binder resin composition which can fix a base without the need of elevating/lowering the temperature of a preform mold. [Solution] A binder resin composition for a preform, which comprises a heat-curable resin [A], a thermoplastic resin [B] and a curing catalyst [C], wherein the heat-curable resin [A] contains a bifunctional epoxy resin, the content of the thermoplastic resin [B] ranges from 10 to 100 parts by mass relative to 100 parts by mass of the heat-curable resin [A], and the curing catalyst [C] is at least one curing catalyst selected from an organophosphorous compound, an imidazole and derivatives thereof.