HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE
摘要
<p>Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor- on-diamond wafers.</p>
申请公布号
WO2014006562(A1)
申请公布日期
2014.01.09
申请号
WO2013IB55417
申请日期
2013.07.02
申请人
ELEMENT SIX TECHNOLOGIES US CORPORATION;FLETCHER WATTS, SUSAN JANE
发明人
DIDUCK, QUENTIN;FRANCIS, DANIEL;LOWE, FRANK, YANTIS;EJECKAM, FELIX