发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
摘要 A printed circuit board is provided. The printed circuit board includes a substrate, an outer part which is formed on the edge of the substrate, a sealing material, and a first dummy pattern which is arranged on the outer part. The first dummy pattern includes a plurality of first core patterns and a connection pattern which connects the first core patterns. The sealing material is formed on one side of the connection pattern which is adjacent to the substrate and is not formed on the other side of the connection pattern.
申请公布号 KR20140002834(A) 申请公布日期 2014.01.09
申请号 KR20120068535 申请日期 2012.06.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHEON, SEUNG JIN
分类号 H05K1/02;H05K3/10 主分类号 H05K1/02
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