发明名称 EPOXY RESIN, EPOXY RESIN COMPOSITION, HARDENED PRODUCT AND LAMINATE FOR ELECTRIC/ELECTRONIC CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin that has high heat resistance, excellent film forming properties, excellent extensibility, and low water absorption properties.SOLUTION: An epoxy resin always includes a bisphenol compound having an anthracene skeleton, the weight average molecular weight of the epoxy resin being 1,000-200,000. An epoxy resin composition is obtained by including, in the epoxy resin, a hardener comprising a phenolic hardener, an amide hardener and imidazoles.
申请公布号 JP2014001380(A) 申请公布日期 2014.01.09
申请号 JP20130110062 申请日期 2013.05.24
申请人 MITSUBISHI CHEMICALS CORP 发明人 TAKAHASHI ATSUSHI;KAMIMURA IHO
分类号 C08G59/06;C08G59/20 主分类号 C08G59/06
代理机构 代理人
主权项
地址