| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape which can be used as a dicing tape in a dicing process, and used as an adhesive having excellent connection reliability in a bonding process of a semiconductor element and a support member for semiconductor element mounting; and which has sufficient heat resistance, moisture resistance, and excellent connection reliability which are necessary for mounting the semiconductor element on the support member for semiconductor element mounting.SOLUTION: An adhesive sheet 10 in which a wafer-shaped adhesive layer 2 is stacked on a base material film 1 having adhesion on one surface on the surface having adhesion is an adhesive sheet which has functions of a dicing sheet and a die bond sheet which are used in a semiconductor device manufacturing method including a plurality of processes. Surface free energy of the base material film on a surface which touches the adhesive layer of the base material film is 25×10N/m-55×10N/m. And a peel strength of the base material film on the surface having adhesion against a wafer holding ring 3 at 25°C is 5-100 N/m. |
