| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability of wiring in an LED package.SOLUTION: A semiconductor package manufacturing method comprises: forming conductive projections 17 on a surface of an electrode part 15 on a top face of an LED element 14 and on a surface of an electrode part 11a on a top face of a package body 13 (or an LED element 14 in which conductive projections 17 are preliminarily formed may be used). The semiconductor package manufacturing method further comprises: subsequently filling a gap around the LED element 14 among element mounting recesses 12 of the package body 13 with the transparent insulation resin 16 to form an embedded layer of the transparent insulation resin 16. At this time, even when the liquid of the insulation resin 16 overflowed from the element mounting recess 12 wet spreads to surfaces of the electrode parts 15, 11a, the conductive projections 17 are exposed from the liquid of the insulation resin 16 because the conductive projections 17 are formed on the surfaces of the electrode parts 15, 11a. The semiconductor package manufacturing method further comprises: subsequently forming wiring 18 on a wiring path between both electrode parts 15, 11a and electrically connecting the wiring 18 to the electrode parts 15, 11a through the conductive projections 17. |
