| 摘要 |
PROBLEM TO BE SOLVED: To provide chips with adhesive films by cutting an adhesive film along the chips, without generating device failure due to clog in a cutting plate or thin burr, die shift, or areas not being fractured.SOLUTION: A wafer processing method comprises the steps for: dividing a wafer 1 into individual chips 15 (division step); adhering an ultraviolet transmitting tape 32 on a rear face 1b of the wafer 1 via an ultraviolet curable die-attach liquid agent 30 (adhesive step) after the division step; irradiating an adhesive film 31 made of the die-attach liquid agent 30 with ultraviolet light from the rear face 1b side of the wafer 1 through the tape 32 to semi-cure the adhesive film 31 after the adhesive step (ultraviolet rear face irradiation step); irradiating the adhesive film 31 with ultraviolet light from a front face 1a side of the wafer 1 to cure only part corresponding to predetermined division lines 11 of the adhesive film 31 (ultraviolet front face irradiation step); and picking up the chips 15 with adhesive films after the irradiation steps. |
