| 摘要 |
PROBLEM TO BE SOLVED: To improve assemblability of a semiconductor module electrically connecting an electrode layer of a semiconductor element with an electrode terminal by pressure-welding.SOLUTION: A contact electrode 4a and a switching element 2 are provided to a fitting hole 7a of a first holding member 7, and a contact electrode 4b and a reflow diode 3 are provided to a fitting hole 7b of the first holding member 7, and the first holding member 7 is provided on a drain electrode terminal 4. The first holding member 7 is fitted with the first holding member fitting groove formed on a lower surface of a second holding member 8, and the second holding member 8 is provided on the drain electrode terminal 4. Gate contact points 10 are inserted into through-holes 8d formed to the second holding member 8, and a hole 6a of a gate electrode terminal 6 is fitted with a peripheral edge part 8c of the second holding member 8. Contact electrodes 5a and 5b are provided to fit a fitting groove 8a of the second holding member 8, and fitting grooves 9d of an electrode holding member 9 integrally configured with a source electrode terminal 5 are fitted with fitting parts 8e of the second holding member 8. |
