发明名称 CARRIER COPPER FOIL REMOVAL APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a carrier copper foil removal apparatus and method, capable of improving reliability of a process by preventing problems caused by manual work such as warpage, damage, and contamination of a base substrate, and inducing failures, and capable of preventing copper foil on the base substrate from being damaged while removing the carrier copper foil from the base substrate.SOLUTION: A carrier copper foil removal apparatus 100 comprises: a work table 110 disposing a base substrate thereon, which first carrier copper foil and second carrier copper foil are respectively attached to both side thereof; cutting means 120 for cutting two corner parts of the base substrate disposed on the work table 110 so that the first carrier copper foil and the second carrier copper foil are left; removal means 130 for removing the first carrier copper foil and the second carrier copper foil from the base substrate; reverse means 140 for reversing the base substrate disposed on the work table 110 by 180°; and a control part 150 for controlling a drive of the cutting means 120, the removal means 130 and the reverse means 140.
申请公布号 JP2014001076(A) 申请公布日期 2014.01.09
申请号 JP20130125993 申请日期 2013.06.14
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人
分类号 B65H41/00;B32B15/08;H05K3/00 主分类号 B65H41/00
代理机构 代理人
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