| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method for obtaining a chip with an adhesive film by easily cutting the adhesive film along a predetermined division line between devices in any type of device.SOLUTION: A wafer processing method comprises the steps for: adhering an ultraviolet curable adhesive film 31 on a rear face 1b of a wafer 1 and further adhering an ultraviolet transmitting tape 32 on the adhesive film 31 (adhesive step); dividing the wafer 1 along predetermined division lines 11 into individual chips 15 (division step); arranging an a mask member 60 having an ultraviolet insulation part 61 which corresponds to a device 14 and an opening 62 which corresponds to the predetermined division line 11 on the rear face 1b side of the wafer 1 and irradiating the adhesive film 31 with ultraviolet light from the rear face 1b side of the wafer 1 through the mask member 60 to cure only part corresponding to the predetermined division lines 11 of the adhesive film 31 after the adhesive step and the division step (ultraviolet light irradiation step); and picking up the chip 15 with the adhesive film after the ultraviolet light irradiation step (pickup step). |
