| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a solid-state image pickup device which can be easily manufactured and has excellent reliability as a product.SOLUTION: The manufacturing method of a solid-state image pickup device 1 includes: a first step of preparing an imaging device 10 including a main surface S1 on which an energy line is to be made incident, a main surface S2 facing the main surface S1 and having an electrode 14 disposed thereon, and a photoelectric conversion part 11 for photoelectrically converting the incident energy line and generating signal charges; a second step of preparing a support substrate 20 provided with at least one through-hole 23 extending in a thickness direction and having main surfaces S3 and S4 that face each other; a third step of positioning the imaging device 10 and the support substrate 20 such that the main surfaces S2 and S3 face each other and one electrode 14 is exposed from one through-hole 23, and joining the imaging device 10 and the support substrate 20; and a fourth step of embedding a conductive member 30 inside the through-hole 23, after the third step. |
