| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which has a structure such that through-wiring path may be constituted of conductor bumps, and which is free of an interfacial peel-off which can be caused easily, in an interface between an end face of each conductor bump and a part of a conductor pattern to be electrically connected to the end face of the conductor bump by a difference between coefficients of linear expansion of the constituent materials of the bump and the pattern, and which can have high reliability in both the mechanical and electrical connections. SOLUTION: In a printed wiring board provided with insulating material layers 2, conductor bumps 3 which pass through the insulating material layers 2 and form wiring path, conductor patterns 6a which, being located airtightly on the surface of the insulator material layer 2, have sections 22 to be electrically connected to end faces 4 of the conductor bumps 3. The sections 22 are as large as or less than the size of the end faces 4 and are located within the projected images, which are obtained by projecting the end faces 4 in the direction of the conductor bumps 3 passing through the insulator layers 2. |
