EXPOSURE METHOD AND EXPOSURE DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent foreign substances such as dust from being sandwiched between a wafer chuck and a wafer. SOLUTION: An exposure chamber 1 is evacuated from under a latticed bottom 2a. After the exposure chamber 1 has reached a predetermined degree of vacuum, helium gas is introduced to control the chamber under an atmosphere of reduced pressure. A wafer chucked by a wafer chuck is exposed to light in this atmosphere. When the chamber 1 is evacuated, foreign substances such as dust on the surface of the wafer chuck and a hand 31 are removed by a foreign substance removing device 40. The foreign substances such as dust fall on the latticed bottom 2a and are ejected with exhaust air when the chamber is evacuated.