发明名称 MEASURING SUBSTRATE, SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT APPARATUS OPERATION METHOD
摘要 The present invention includes a first substrate having a sensor part for measuring a measured factor and a second substrate that is to be detachably stacked on a lower side of the first substrate, the second substrate including: a signal processing part that processes a measurement signal obtained by measurement by the sensor part; a power supply part for feeding power to the sensor part; and at least either a memory that stores measurement data obtained by being processed in the signal processing part or a communication part for transmitting the measurement data by wireless, wherein the second substrate is in common use for a plurality of kinds of first substrates different in measured factor measured by the sensor part from each other.
申请公布号 US2014007669(A1) 申请公布日期 2014.01.09
申请号 US201313925919 申请日期 2013.06.25
申请人 TOKYO ELECTRON LIMITED 发明人 AKADA HIRAKU
分类号 G01P13/00;G01F1/00 主分类号 G01P13/00
代理机构 代理人
主权项
地址