发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH GRID-ARRAY MECHANISM AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes providing a lead-frame having an inner portion and a bottom cover directly on a bottom surface of the inner portion; forming an insulation cover directly on the lead-frame with the insulation cover having a connection opening; connecting an integrated circuit die to the lead-frame through the connection opening with the integrated circuit die over the insulation cover; forming a top encapsulation directly on the insulation cover; forming a routing layer having a conductive land directly on the bottom cover by shaping the lead-frame; and forming a bottom encapsulation directly on the conductive land with the bottom cover exposed from the bottom encapsulation. |
申请公布号 |
US2014008774(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213542120 |
申请日期 |
2012.07.05 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
分类号 |
H01L23/495;H01L21/56;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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