SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING IMPROVED HEAT DISSIPATION CAPABILITIES
摘要
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.
申请公布号
WO2008021220(A3)
申请公布日期
2014.01.09
申请号
WO2007US17768
申请日期
2007.08.10
申请人
VISHAY GENERAL SEMICONDUCTOR LLC;CHOU, TA-TE;ZHANG, XIONG-JIE;LI, XIAN;FU, HAI;TIAN, YONG-QI