发明名称 PLASTIC PACKAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To adjust pressure with high accuracy in a manner such that a detecting means for detecting the pressure of an upper-half molding die to a lower-half molding die is provided between a fixed member fixed to a tie bar on the other side of the side on which the lower-half molding die is provided so as to accurately detect the pressure of the molding die. SOLUTION: An upper-half molding die 5 is provided below a moving platen 4, and a lower-half molding die 6 is provided above a lower platen 2. A lower fixed nut 11 is fixed to a tie bar 3 on the opposite side of the side on which the lower-half molding die 6 is provided. A load cell 12 for detecting the pressure of the upper-half molding die 5 to the lower-half molding die 6 is provided between the lower fixed nut 11 and the lower platen 2. The pressure of the upper-half molding die 5 to the lower-half molding die 6 is therefore directly transmitted to the load cell 12. Consequently, a pressure detection error caused by influences such as backlash or deformation of component elements due to aging of the apparatus and expansion of the tie bar 3 by a heat is reduced, and the pressure can be more accurately detected.
申请公布号 JPH10144709(A) 申请公布日期 1998.05.29
申请号 JP19960302916 申请日期 1996.11.14
申请人 NEC CORP 发明人 HONDO YUKINORI;YANAI MITSUHIRO
分类号 B29C45/64;B29C45/02;B29C45/76;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/64
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