| 摘要 |
Provided are a liquid composition for etching and a multi-layer print wiring board using the same for efficiently removing a chemistry copper plating which is a seed layer in a semi additive construction method in a multi-layer print wiring board manufacture and for batch processing a minuteness texturing of a wiring surface. According to the present invention, a liquid composition for etching for manufacturing a multi-layer print wiring board comprises: 0.2-5 mass% of hydrogen peroxide, 0.5-8 mass% of sulfuric acid, 0.3-3 ppm of halogen ion, and 0.003-0.3 mass% of tetrazoles. |
